645中文資料先進能源工業(yè)數據手冊PDF規(guī)格書

PRODUCT HIGHLIGHTS

? Supports both Coulombic and Johnsen-Rahbek ESC technologies

? User configurable for custom clamp and declamp sequences and wave shapes

? Electrostatic chuck profiles can be uploaded to the unit and stored internally via a

user-friendly software interface

? Documented reduction of backside gas errors, increased throughput, and

elimination of sticky/popping wafers

? Lockable front panel control interface

? Ability to control parameters such as over-current, wafer-present and waferclamped

thresholds, clamp voltage, offset voltage and internal or external

amplitude/offset control

? Wafer detection includes no wafer, wafer present or wafer clamped status

? Includes in-process-adjustable amplitude/offset and output-control versatility

? Output can be controlled by back panel I/O, serial computer command or front panel

controls

? NIST-traceable Certificate of Calibration provided with each unit