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33662

ISO 17987/LIN 2.x/SAEJ2602-2 LIN Physical Layer

TheLocalInterconnectNetwork(LIN)isaserialcommunication protocol,designedtosupportautomotivenetworksinconjunctionwith aControllerAreaNetwork(CAN).Asthelowestlevelofahierarchical network,LINenablescost-effectivecommunicationwithsensorsand actuatorswhenallthe

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

336624B00032G

Channel style heat sink with folded back fins

Channelstyleheatsinkwithfoldedbackfinsforincreasedcoolingsurfacearea.Availablewithtinplatedsolderabletabsforeasyattachmenttotheprintedcircuitcard.

AAVID

Aavid, Thermal Division of Boyd Corporation

336624B00032G

How to Use This Catalog

AAVID

Aavid, Thermal Division of Boyd Corporation

33662131000059

包裝：散裝 類別：電纜組件 D-Sub 電纜 描述：D-SUB 9P MALE,DOUBLE END, L=1.0M

HARTINGHarting Technology Group

浩亭浩亭技術(shù)集團(tuán)

33662135000062

包裝：袋 類別：電纜組件 D-Sub 電纜 描述：D-SUB 9P MALE,DOUBLE END, L=5.0M

HARTINGHarting Technology Group

浩亭浩亭技術(shù)集團(tuán)

MC33662

ISO17987/LIN2.x/SAEJ2602-2LINPhysicalLayer

TheLocalInterconnectNetwork(LIN)isaserialcommunication protocol,designedtosupportautomotivenetworksinconjunctionwith aControllerAreaNetwork(CAN).Asthelowestlevelofahierarchical network,LINenablescost-effectivecommunicationwithsensorsand actuatorswhenallthe

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

MC33662BJEF

ISO17987/LIN2.x/SAEJ2602-2LINPhysicalLayer

TheLocalInterconnectNetwork(LIN)isaserialcommunication protocol,designedtosupportautomotivenetworksinconjunctionwith aControllerAreaNetwork(CAN).Asthelowestlevelofahierarchical network,LINenablescost-effectivecommunicationwithsensorsand actuatorswhenallthe

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

MC33662BLEF

ISO17987/LIN2.x/SAEJ2602-2LINPhysicalLayer

TheLocalInterconnectNetwork(LIN)isaserialcommunication protocol,designedtosupportautomotivenetworksinconjunctionwith aControllerAreaNetwork(CAN).Asthelowestlevelofahierarchical network,LINenablescost-effectivecommunicationwithsensorsand actuatorswhenallthe

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

MC33662BSEF

ISO17987/LIN2.x/SAEJ2602-2LINPhysicalLayer

TheLocalInterconnectNetwork(LIN)isaserialcommunication protocol,designedtosupportautomotivenetworksinconjunctionwith aControllerAreaNetwork(CAN).Asthelowestlevelofahierarchical network,LINenablescost-effectivecommunicationwithsensorsand actuatorswhenallthe

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

MC33662JEF

ISO17987/LIN2.x/SAEJ2602-2LINPhysicalLayer

TheLocalInterconnectNetwork(LIN)isaserialcommunication protocol,designedtosupportautomotivenetworksinconjunctionwith aControllerAreaNetwork(CAN).Asthelowestlevelofahierarchical network,LINenablescost-effectivecommunicationwithsensorsand actuatorswhenallthe

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

詳細(xì)參數(shù)

  • 型號：

    33662

  • 功能描述：

    電纜組件 CABLE ASSEMBLY DBL END 1M

  • RoHS：

    否

  • 制造商：

    Molex

  • 產(chǎn)品：

    Power Assemblies

  • 類型：

    Cable Assembly 連接器端口

  • A：

    No Connector 連接器端口 A

  • 管腳計數(shù)：

    4 連接器端口

  • B：

    No Connector 連接器端口 B

  • 型式：

    Male 線規(guī) -

  • 美國線規(guī)（AWG）：

    20, 28

  • 長度：

    0.305 m

  • 顏色：

    Black, Red

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更多33662供應(yīng)商 更新時間2025-3-25 17:34:00

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