1930005836-01

Embedded System with 4 PCIE Expansion Slots

Features ?4UEmbeddedSystem ?Upto4PCIEExpansionSlots ?Upto6ShockResistant2.5drivebays ?Toaccommodate700Woroptional1200WPSUfordifferentapplications ?PlentifulIOPortsforVariousApplications ?ServerGradeCPUforHigh-endComputing

1930006016-02

Development Kit for Qseven 2.0 CPU Module ROM-7510

Features ??EvaluationkitforROM-7510 ??EnhancedperformanceTISitaraAM5728Dualcorecortex-A151.5GHzhigh performanceprocessor ??OnbardDDR32GBmemoryandeMMC8GB ??HDMI,Dualchannel24bitLVDS,1920x1080 ??Supports8GBeMMCFlash,1SD/MMC,1SATA ??Supports1PCIe,1Gb

1930006770-01

Intel? Wireless 6E AX210 (No vPro) M.2 2230 A-E Key module with cables and antennas

Features ?IEEE802.11ax/ac/a/b/g/n(2.4GHz/5GHz/6GHz)+Bluetooth5.3 ?2Tx/2Rx ?WPA2*,WPA3* ?802.1xEAP-TLS,EAP-TTLS/MSCHAPv2,PEAPv0-MSCHAPv2(EAP-SIM, EAP-AKA,EAP-AKA') ?Supportswideoperatingtemperatures(-40~85°C/-40~185°F) ?SupportsWindows10*,Linux*,andChromeOS* ?

1930006770-01

Intel? Wireless 6E AX210 (No vPro) M.2 2230 A-E Key module with cables and antennas

Features ?IEEE802.11ax/ac/a/b/g/n(2.4GHz/5GHz/6GHz)+Bluetooth5.3 ?2Tx/2Rx ?WPA2*,WPA3* ?802.1xEAP-TLS,EAP-TTLS/MSCHAPv2,PEAPv0-MSCHAPv2(EAP-SIM,EAP-AKA,EAP-AKA') ?Supportswideoperatingtemperatures(0~70°C/32~158°F) ?SupportsWindows10*,Linux*,andChromeOS* ?W

1930006770-01

Intel? Wireless 6E AX210 (Vpro) M.2 2230 A-E Key module with cables and antennas

Features ?IEEE802.11ax/ac/a/b/g/n(2.4GHz/5GHz/6GHz)+Bluetooth5.3 ?2Tx/2Rx ?WPA2*,WPA3* ?802.1xEAP-TLS,EAP-TTLS/MSCHAPv2,PEAPv0-MSCHAPv2(EAP-SIM, EAP-AKA,EAP-AKA') ?Supportswideoperatingtemperatures(-40~85°C/-40~185°F) ?SupportsWindows10*,Linux*,andChromeOS*

1930006770-01

Intel? Atom? E3950/E3930 DC 1.6/1.3 GHz UTX Industrial Motherboard with HDMI/eDP (LVDS)/DP, 2 COMs and Dual LAN

Features ?SupportsIntel?Atom?Quad/DualcoreE3950/E39301.6/1.3GHz processor ?Single204-pinSO-DIMMupto8GBDDR3L1866MHzSDRAM ?SupportsHDMI/DP++,eDP(co-laydual-channel48-bitLVDS) ?Supports1Mini-PCIEexpansionslot,M.2E-Keyslot,2COMs (RS-232,RS-422/485),4USB3

1930006770-01

Intel 8th Gen U Series CORE i3/i5/i7 CPU,eDP (LVDS), 2 HDMI, 2 LAN, 2 USB3.2 Gen2 x1, 4 COM (RS-232/422/485),M.2 E-Key, M.2 B-Key, M.2 M-Key NVMe

Features ?Intel?8thGenCore?i3-8145UE/i5-8365UE/i7-8665UE/CELERON 4305UE ?Supports1xDDR4-2400SO-DIMM ?Supports1xeDP(LVDSco-lay),2xHDMI,3IndependentDisplays ?Supports2xLAN,2xUSB3.2Gen2x1Type-APorts,4COMPorts (RS-232/422/485,selectedviaBIOS) ?Support

1930006770-01

IEEE 802.11ax (2.4G/5G) Bluetooth 5.3 LGA Module

Features ?IEEE802.11ax/ac/a/b/g/n(2.4GHz/5GHz)+Bluetooth5.3 ?2Tx/2Rx ?Wi-Fi:WPA/WPA2/WPA3 ?Operatingtemperature:-40~85°C(-40~185°F) ?SupportsLinux ?Wi-Fi:UplinkanddownlinkOFDMAandMU-MIMO ?BT:LTE/MWScoexistence

1930006770-01

IEEE 802.11ax (2.4G/5G) Bluetooth 5.3 M.2 2830 E key Module

Features ?IEEE802.11ax/ac/a/b/g/n(2.4GHz/5GHz)+Bluetooth5.3 ?2Tx/2Rx ?Wi-Fi:WPA/WPA2/WPA3 ?Operatingtemperature:-40~85°C(-40~185°F) ?SupportsLinux ?Wi-Fi:UplinkanddownlinkOFDMAandMU-MIMO ?BT:LTE/MWScoexistence

1930006770-01

Embedded Mini-ITX Chassis with One Expansion Slot

Features ?SupportsIntel?7thGenCore?&6thGenCore?iprocessor/Pentium/ Celeron(LGA1151)withIntelH110chipset ?Two260-pinSO-DIMMupto32GBDDR42133MHzSDRAM ?SupportsDualdisplayconfigurationbymultipleinterface:DP/DVI-D/VGA ?SupportsDirectX12,OpenGL4.4,OpenCL2.