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CDBF0230L-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackagemoldedplastic. Terminals:Goldplated,sol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230R

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230R-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Halogenfree. Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solde

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0230

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Goldplated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0230-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowdrop-downvoltage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0230L

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage moldedplastic. Terminals:Goldplated,solde

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0230L-HF

SMDSchottkyBarrierDiode

Io=200mA RoHSDevice HalogenFree VR=30Volts Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0230R-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBH0230-F-HF

SMDSmallSignalSchottkyDiodes

Features -Extremelyfastswitchingspeed. -Lowforwardvoltage.

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBH0230-G

SMDSmallSignalSchottkyDiodes

COMCHIPComchip Technology

典琦典琦科技股份有限公司

產(chǎn)品屬性

  • 產(chǎn)品編號:

    0230-A

  • 制造商:

    Davies Molding, LLC

  • 類別:

    盒子,外殼,機架 > 箱

  • 系列:

    0230

  • 包裝:

    散裝

  • 容器類型:

  • 大小 / 尺寸:

    5.010" 長 x 4.250" 寬(127.25mm x 107.95mm)

  • 高度:

    1.750"(44.45mm)

  • 面積 (L x W):

    21.3in2(137cm2)

  • 設(shè)計:

    開端

  • 材料:

    塑料 - 酚醛塑料

  • 顏色:

    黑色

  • 厚度:

    0.130"(3.30mm)

  • 特性:

    耐熱

  • 描述:

    BOX PLAS BLK 5.010\

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更多0230-A供應(yīng)商 更新時間2025-4-5 16:06:00